MPC5123YVY400B vs MPC5123YVY300B feature comparison

MPC5123YVY400B NXP Semiconductors

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MPC5123YVY300B Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 27 X 27 MM, 2.25 HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TFBGA-516
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Address Bus Width 32
Boundary Scan YES YES
Clock Frequency-Max 35 MHz
External Data Bus Width 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 516 516
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 400 MHz 300 MHz
Supply Voltage-Max 1.47 V 1.47 V
Supply Voltage-Min 1.33 V 1.33 V
Supply Voltage-Nom 1.4 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 NOT SPECIFIED
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Part Package Code BGA
Pin Count 516
Bit Size 32
Package Equivalence Code BGA516,26X26,40

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