MPC5123YVY400B vs MPC8280ZQPX feature comparison

MPC5123YVY400B Freescale Semiconductor

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MPC8280ZQPX NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, 2.25 HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-516 27 X 27 MM, 2.25 MM, 1 MM PITCH, PLASTIC, BGA-516
Pin Count 516
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 35 MHz 66 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e2
Length 27 mm 27 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 516 516
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 400 MHz 300 MHz
Supply Voltage-Max 1.47 V 1.6 V
Supply Voltage-Min 1.33 V 1.45 V
Supply Voltage-Nom 1.4 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2

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