MPC564CZP66
vs
MPC564MZP66
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
|
BGA,
|
| Pin Count |
388
|
388
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
24
|
24
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B388
|
S-PBGA-B388
|
| JESD-609 Code |
e0
|
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
16
|
16
|
| Number of Terminals |
388
|
388
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
240
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Speed |
66 MHz
|
66 MHz
|
| Supply Voltage-Max |
2.7 V
|
2.7 V
|
| Supply Voltage-Min |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom |
2.6 V
|
2.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
2
|
| HTS Code |
|
8542.31.00.01
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MPC564CZP66 with alternatives
Compare MPC564MZP66 with alternatives