MPC564CZP66 vs MPC564MZP66R2 feature comparison

MPC564CZP66 Rochester Electronics LLC

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MPC564MZP66R2 Freescale Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388
Pin Count 388 388
Reach Compliance Code unknown not_compliant
Has ADC NO NO
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 16 16
Number of Terminals 388 388
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240 240
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 66 MHz 66 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Tin/Lead/Silver (Sn62Pb36Ag2)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
ECCN Code 3A991
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
On Chip Program ROM Width 8
Package Equivalence Code BGA388,26X26,40
Qualification Status Not Qualified
RAM (bytes) 32768
ROM (words) 524288

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