MPC564MZP56 vs MPC555LFMZP40 feature comparison

MPC564MZP56 NXP Semiconductors

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MPC555LFMZP40 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151, BGA-388 BGA,
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 16 Weeks
Has ADC NO
Address Bus Width 24
Bit Size 32 32
Clock Frequency-Max 20 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width 32
JESD-30 Code S-PBGA-B388 S-PBGA-B272
JESD-609 Code e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3
Number of I/O Lines 16
Number of Terminals 388 272
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified COMMERCIAL
RAM (bytes) 32768
ROM (words) 524288
ROM Programmability FLASH
Seated Height-Max 2.55 mm 2.65 mm
Speed 56 MHz
Supply Voltage-Max 2.7 V 3.6 V
Supply Voltage-Min 2.5 V 3 V
Supply Voltage-Nom 2.6 V 3.3 V
Surface Mount YES YES
Technology CMOS HCMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 272
Additional Feature ALSO REQUIRES 5V SUPPLY

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Compare MPC555LFMZP40 with alternatives