MPC565CZP56 vs MPC565MVR56R2 feature comparison

MPC565CZP56 Motorola Mobility LLC

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MPC565MVR56R2 Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, 27 X 27 MM, 1 MM PITCH, PLASTIC, MO-151AAL-1, BGA-388
Pin Count 388 388
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature ALSO REQUIRES 5V SUPPLY ALSO REQUIRES 5V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 84 MHz 84 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B388 S-PBGA-B388
Length 27 mm 27 mm
Number of I/O Lines
Number of Terminals 388 388
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 56 MHz 56 MHz
Supply Voltage-Max 2.7 V 2.7 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.6 V 2.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1
Rohs Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Peak Reflow Temperature (Cel) 260
ROM (words) 1048576
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 40

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