MPC8245LVV300D
vs
PC8240VTPU200EZD3
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
| Package Description |
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
66 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B352
|
|
| JESD-609 Code |
e1
|
|
| Length |
35 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
352
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LBGA
|
|
| Package Equivalence Code |
BGA352,26X26,50
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.65 mm
|
|
| Speed |
300 MHz
|
|
| Supply Voltage-Max |
2.1 V
|
|
| Supply Voltage-Min |
1.7 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
35 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
| Base Number Matches |
1
|
|
|
|
|
Compare MPC8245LVV300D with alternatives