MPC8245LZU266D
vs
PC8240VTPU200EZD3
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
Package Description |
35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
|
|
Reach Compliance Code |
unknown
|
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Address Bus Width |
32
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
66 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B352
|
|
JESD-609 Code |
e0
|
|
Length |
35 mm
|
|
Low Power Mode |
YES
|
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
352
|
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA352,26X26,50
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.65 mm
|
|
Speed |
266 MHz
|
|
Supply Voltage-Max |
2.1 V
|
|
Supply Voltage-Min |
1.7 V
|
|
Supply Voltage-Nom |
1.8 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
Base Number Matches |
1
|
|
|
|
|
Compare MPC8245LZU266D with alternatives