MPC8245LZU300B vs XPC8245LZU266B feature comparison

MPC8245LZU300B Motorola Mobility LLC

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XPC8245LZU266B Freescale Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description LBGA, BGA352,26X26,50 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352
Pin Count 352 352
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2V SUPPLY ALSO OPERATES AT 2V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B352
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 352 352
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 1.65 mm
Speed 300 MHz 266 MHz
Supply Voltage-Max 1.9 V 1.9 V
Supply Voltage-Min 1.7 V 1.7 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 30

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