MPC8245TZU300D vs MCF5470VR200 feature comparison

MPC8245TZU300D Motorola Semiconductor Products

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MCF5470VR200 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Not Recommended
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description 35 X 35 MM, 1.70 MM HEIGHT, 1.27 MM PITCH, CAVITY-UP, TBGA-352 27 X 27 MM, MS-034AAL-1, PBGA-388
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO OPERATES AT 2V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66.66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B352 S-PBGA-B388
Length 35 mm 27 mm
Low Power Mode YES YES
Number of Terminals 352 388
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.65 mm 2.55 mm
Speed 300 MHz 200 MHz
Supply Voltage-Max 1.9 V 1.58 V
Supply Voltage-Min 1.7 V 1.43 V
Supply Voltage-Nom 1.8 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 35 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 2
Factory Lead Time 13 Weeks
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Operating Temperature-Min
Temperature Grade COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)

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