MPC8250ACZQIHBC vs SPC5121YVY400BR feature comparison

MPC8250ACZQIHBC NXP Semiconductors

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SPC5121YVY400BR NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516 BGA, BGA516,26X26,40
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days 2 Days
Samacsys Manufacturer NXP
Additional Feature REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e2
Length 27 mm 27 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 200 MHz 400 MHz
Supply Voltage-Max 1.9 V 1.47 V
Supply Voltage-Min 1.7 V 1.33 V
Supply Voltage-Nom 1.8 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code BGA516,26X26,40
Screening Level AEC-Q100
Temperature Grade INDUSTRIAL

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