MPC8250ACZQIHBC vs MPC8306SVMACDCA feature comparison

MPC8250ACZQIHBC Motorola Mobility LLC

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MPC8306SVMACDCA NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369
Pin Count 516
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B369
Length 27 mm 19 mm
Low Power Mode NO YES
Number of Terminals 516 369
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 1.61 mm
Speed 200 MHz 200 MHz
Supply Voltage-Max 1.9 V 1.05 V
Supply Voltage-Min 1.7 V 0.95 V
Supply Voltage-Nom 1.8 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 5 2
Rohs Code Yes
ECCN Code 3A991.A.2
Samacsys Manufacturer NXP
Clock Frequency-Max 66.67 MHz
JESD-609 Code e2
Moisture Sensitivity Level 3
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Equivalence Code BGA369,23X23,32
Peak Reflow Temperature (Cel) 260
Temperature Grade OTHER
Terminal Finish Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s) 40

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