MPC8255AZUMHBB vs MPC8260ACZUMHBB feature comparison

MPC8255AZUMHBB Freescale Semiconductor

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MPC8260ACZUMHBB Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description LBGA, BGA480,29X29,50 37.50 X 37.50 MM, 1.55 MM HEIGHT, 1.27 MM PITCH, TBGA-480
Pin Count 480 480
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.66 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B480 S-PBGA-B480
JESD-609 Code e0 e0
Length 37.5 mm 37.5 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 3
Number of Terminals 480 480
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA480,29X29,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 220 220
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.65 mm 1.65 mm
Speed 266 MHz 266 MHz
Supply Voltage-Max 2.2 V 2.2 V
Supply Voltage-Min 1.9 V 1.9 V
Supply Voltage-Nom 2 V 2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 4 5

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