MPC8270VRUPEX vs MPC5123YVY300B feature comparison

MPC8270VRUPEX NXP Semiconductors

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MPC5123YVY300B Freescale Semiconductor

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TFBGA-516
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz
External Data Bus Width 64
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
Length 27 mm 27 mm
Low Power Mode NO YES
Number of Terminals 516 516
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 450 MHz 300 MHz
Supply Voltage-Max 1.6 V 1.47 V
Supply Voltage-Min 1.45 V 1.33 V
Supply Voltage-Nom 1.5 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Rohs Code Yes
Part Package Code BGA
Pin Count 516
Package Equivalence Code BGA516,26X26,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare MPC5123YVY300B with alternatives