MPC8270ZQMIBA vs MPC8275CZQMIBA feature comparison

MPC8270ZQMIBA Rochester Electronics LLC

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MPC8275CZQMIBA Freescale Semiconductor

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Pbfree Code Yes No
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516
Pin Count 516 516
Reach Compliance Code unknown not_compliant
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 266 MHz 266 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e0
Length 27 mm 27 mm
Low Power Mode NO NO
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 66.67 MHz 66.67 MHz
Supply Voltage-Max 1.6 V 1.6 V
Supply Voltage-Min 1.45 V 1.45 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 2
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Package Equivalence Code BGA516,26X26,40
Technology CMOS

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