MPC8270ZQMIBA
vs
MPC8306VMACDCA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516
|
19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
|
| Pin Count |
516
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
266 MHz
|
66.67 MHz
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B369
|
| JESD-609 Code |
e0
|
e2
|
| Length |
27 mm
|
19 mm
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
516
|
369
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
245
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
1.61 mm
|
| Speed |
66.67 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.6 V
|
|
| Supply Voltage-Min |
1.45 V
|
|
| Supply Voltage-Nom |
1.5 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver (Sn/Ag)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
27 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
NXP
|
| Technology |
|
CMOS
|
|
|
|
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