MPC8275CVRTPEX vs MPC8306VMADDCA feature comparison

MPC8275CVRTPEX Freescale Semiconductor

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MPC8306VMADDCA NXP Semiconductors

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
Pin Count 516
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 66.67 MHz
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B369
Length 27 mm 19 mm
Low Power Mode NO YES
Number of Terminals 516 369
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 1.61 mm
Speed 400 MHz 266 MHz
Supply Voltage-Max 1.6 V
Supply Voltage-Min 1.45 V
Supply Voltage-Nom 1.5 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Silver (Sn/Ag)
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8275CVRTPEX with alternatives

Compare MPC8306VMADDCA with alternatives