MPC8275VRQLDX
vs
MPC8313CZQAGD
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
|
Pin Count |
516
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
ALSO REQUIRES 3.3V I/O SUPPLY
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
83.33 MHz
|
66.67 MHz
|
External Data Bus Width |
64
|
32
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B516
|
Length |
27 mm
|
27 mm
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
516
|
516
|
Operating Temperature-Max |
70 °C
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
HBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.55 mm
|
2.55 mm
|
Speed |
333 MHz
|
400 MHz
|
Supply Voltage-Max |
1.6 V
|
1.5 V
|
Supply Voltage-Min |
1.45 V
|
0.95 V
|
Supply Voltage-Nom |
1.5 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
Base Number Matches |
1
|
4
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Package Equivalence Code |
|
BGA516,26X26,40
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MPC8275VRQLDX with alternatives
Compare MPC8313CZQAGD with alternatives