MPC8275ZQMIBA vs MPC8323EVRAFDCA feature comparison

MPC8275ZQMIBA Rochester Electronics LLC

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MPC8323EVRAFDCA NXP Semiconductors

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, PBGA-516
Pin Count 516
Reach Compliance Code unknown compliant
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 266 MHz 66.67 MHz
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e2
Length 27 mm 27 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 66.67 MHz 333 MHz
Supply Voltage-Max 1.6 V 1.05 V
Supply Voltage-Min 1.45 V 0.95 V
Supply Voltage-Nom 1.5 V 1 V
Surface Mount YES YES
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 3 2
ECCN Code 5A002.A.1
HTS Code 8542.31.00.01
Factory Lead Time 52 Weeks
Samacsys Manufacturer NXP
Technology CMOS

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