MPC8306CVMADDCA vs MPC8250ACZQIHBC feature comparison

MPC8306CVMADDCA NXP Semiconductors

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MPC8250ACZQIHBC NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369 27 X 27 MM, 1.25 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-516
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP NXP
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B369 S-PBGA-B516
JESD-609 Code e2 e0
Length 19 mm 27 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3 3
Number of Terminals 369 516
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.61 mm 2.55 mm
Speed 266 MHz 200 MHz
Supply Voltage-Nom 1 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Silver (Sn/Ag) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 19 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 5
Factory Lead Time 2 Days
Additional Feature REQUIRES 3.3V SUPPLY FOR I/O
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V

Compare MPC8306CVMADDCA with alternatives

Compare MPC8250ACZQIHBC with alternatives