MPC8308CZQADD
vs
MPC8308VMADDA
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
19 X 19 MM, 0.80 MM PITCH, 1.39 MM HEIGHT, MAPBGA-473
|
19 X 19 MM, 1.39 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MABGA-473
|
| Pin Count |
473
|
473
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A991
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
266 MHz
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B473
|
S-PBGA-B473
|
| JESD-609 Code |
e0
|
e2
|
| Length |
19 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
473
|
473
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
|
| Package Equivalence Code |
BGA473,23X23,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.54 mm
|
|
| Speed |
266 MHz
|
|
| Supply Voltage-Max |
1.05 V
|
|
| Supply Voltage-Min |
0.95 V
|
|
| Supply Voltage-Nom |
1 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
19 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
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