MPC8313ECZQAFF
vs
MPC8313ECVRAFFA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
|
27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, LEAD FREE, TEPBGAII-516
|
| Pin Count |
516
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
5A002
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 3.3V I/O SUPPLY
|
ALSO REQUIRES 3.3V I/O SUPPLY
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.67 MHz
|
66.67 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B516
|
S-PBGA-B516
|
| JESD-609 Code |
e0
|
e1
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
516
|
516
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
2.55 mm
|
| Speed |
333 MHz
|
333 MHz
|
| Supply Voltage-Max |
1.5 V
|
1.5 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
4
|
1
|
|
|
|
Compare MPC8313ECZQAFF with alternatives
Compare MPC8313ECVRAFFA with alternatives