MPC8313ZQAFFC vs MPC8313ZQAFFB feature comparison

MPC8313ZQAFFC Freescale Semiconductor

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MPC8313ZQAFFB Freescale Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Package Description TEBGAII-516 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.A.2 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 15 32
Bit Size 32 32
Boundary Scan YES YES
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B516
JESD-609 Code e0 e0
Length 27 mm 27 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 516
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA516,26X26,40 BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 333 MHz 333 MHz
Supply Voltage-Max 1.05 V 1.5 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 1
Part Package Code BGA
Pin Count 516
Additional Feature ALSO REQUIRES 3.3V I/O SUPPLY
Clock Frequency-Max 66.67 MHz

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