MPC8347CZUAGF vs MPC8347EVVAJF feature comparison

MPC8347CZUAGF NXP Semiconductors

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MPC8347EVVAJF Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description LBGA, 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0 e1
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 672 672
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 400 MHz 533 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD SILVER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code Yes
Part Package Code BGA
Pin Count 672
Moisture Sensitivity Level 3
Package Equivalence Code BGA672,34X34,40
Peak Reflow Temperature (Cel) 260
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 40

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