MPC8347ECZUAGFB vs MPC8347EVVAGF feature comparison

MPC8347ECZUAGFB NXP Semiconductors

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MPC8347EVVAGF NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672 LBGA, BGA672,34X34,40
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B672 S-PBGA-B672
Length 35 mm 35 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 672 672
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA672,34X34,40 BGA672,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 2

Compare MPC8347ECZUAGFB with alternatives

Compare MPC8347EVVAGF with alternatives