MPC8347EZUAGF vs MPC8347EVVAGDB feature comparison

MPC8347EZUAGF NXP Semiconductors

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MPC8347EVVAGDB NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-672 35 X 35 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-672
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B672 S-PBGA-B672
JESD-609 Code e0
Length 35 mm 35 mm
Low Power Mode YES YES
Number of Terminals 672 672
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA672,34X34,40 BGA672,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 400 MHz 400 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 2
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 2.5V AND 3.3V SUPPLY
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8347EZUAGF with alternatives

Compare MPC8347EVVAGDB with alternatives