MPC8358EVRAGDDA
vs
MPC8358VRAGDDA
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668
|
29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668
|
| Pin Count |
668
|
668
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A002
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
NXP
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
66.67 MHz
|
66.67 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B668
|
S-PBGA-B668
|
| JESD-609 Code |
e2
|
e2
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
668
|
668
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HBGA
|
| Package Equivalence Code |
BGA668,28X28,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2.46 mm
|
2.46 mm
|
| Speed |
400 MHz
|
400 MHz
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Terminal Finish |
TIN SILVER
|
TIN COPPER/TIN SILVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare MPC8358EVRAGDDA with alternatives