MPC850DEVR50BU vs MIP7365-450B1M feature comparison

MPC850DEVR50BU Freescale Semiconductor

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MIP7365-450B1M Cobham Power Products

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC AEROFLEX PLAINVIEW
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 BGA,
Pin Count 256 256
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 26
Bit Size 32 64
Boundary Scan YES YES
Clock Frequency-Max 50 MHz 133 MHz
External Data Bus Width 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 R-PBGA-B256
JESD-609 Code e1
Length 23 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 256 256
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.35 mm
Speed 50 MHz 450 MHz
Supply Voltage-Max 3.465 V 1.35 V
Supply Voltage-Min 3.135 V 1.25 V
Supply Voltage-Nom 3.3 V 1.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 1
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Screening Level MIL-STD-883
Temperature Grade MILITARY

Compare MPC850DEVR50BU with alternatives

Compare MIP7365-450B1M with alternatives