MPC850DEVR50BU vs SC220I0BTAV001 feature comparison

MPC850DEVR50BU Freescale Semiconductor

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SC220I0BTAV001 Microsemi Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC MICROSEMI CORP
Part Package Code BGA BGA
Package Description 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-256 ,
Pin Count 256 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 26
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 50 MHz
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B256
JESD-609 Code e1
Length 23 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2.35 mm
Speed 50 MHz
Supply Voltage-Max 3.465 V
Supply Voltage-Min 3.135 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Base Number Matches 2 1

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