MPC852TCVR66A
vs
KMPC870ZT66
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
PLASTIC, BGA-256
PLASTIC, BGA-256
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
23 mm
23 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
256
256
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Equivalence Code
BGA256,16X16,50
BGA256,16X16,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
2.54 mm
Speed
66 MHz
66 MHz
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
23 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare MPC852TCVR66A with alternatives
Compare KMPC870ZT66 with alternatives