MPC8555ECPXALF vs MPC8555PXALF feature comparison

MPC8555ECPXALF Freescale Semiconductor

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MPC8555PXALF NXP Semiconductors

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, BGA783,28X28,40 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
Pin Count 783
Reach Compliance Code not_compliant unknown
ECCN Code 5A002 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 64 64
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166 MHz 166 MHz
External Data Bus Width 64 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B783 S-PBGA-B783
JESD-609 Code e0 e0
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 783 783
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA783,28X28,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.75 mm 3.75 mm
Speed 667 MHz 667 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Factory Lead Time 4 Weeks

Compare MPC8555ECPXALF with alternatives

Compare MPC8555PXALF with alternatives