MPC8560CVT667JC vs MPC8544VTANJB feature comparison

MPC8560CVT667JC NXP Semiconductors

Buy Now

MPC8544VTANJB Freescale Semiconductor

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 BGA,
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Address Bus Width 64 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 166 MHz 0.4 MHz
External Data Bus Width 64 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B783 S-PBGA-B783
JESD-609 Code e2 e2
Length 29 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 783 783
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.85 mm 2.8 mm
Speed 667 MHz 800 MHz
Supply Voltage-Max 1.26 V 1.05 V
Supply Voltage-Min 1.14 V 0.95 V
Supply Voltage-Nom 1.2 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver (Sn/Ag) TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 29 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Part Package Code BGA
Pin Count 783

Compare MPC8560CVT667JC with alternatives

Compare MPC8544VTANJB with alternatives