MPC8572EPXAVND
vs
MPC8568EVTAUJJA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
|
| Package Description |
33 X 33 MM, PLASTIC, FCBGA-1023
|
BGA,
|
| Pin Count |
1023
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
5A002.A
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
166 MHz
|
| External Data Bus Width |
32
|
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B1023
|
S-PBGA-B1023
|
| JESD-609 Code |
e0
|
e2
|
| Length |
33 mm
|
33 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
1023
|
1023
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
BGA
|
| Package Equivalence Code |
BGA1023,32X32,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.38 mm
|
2.75 mm
|
| Speed |
1500 MHz
|
1333 MHz
|
| Supply Voltage-Max |
1.155 V
|
1.155 V
|
| Supply Voltage-Min |
1.045 V
|
1.045 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
TIN SILVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
33 mm
|
33 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MPC8572EPXAVND with alternatives
Compare MPC8568EVTAUJJA with alternatives