MPC8572EPXAVND vs MPC8572ELVTAVNE feature comparison

MPC8572EPXAVND Freescale Semiconductor

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MPC8572ELVTAVNE Freescale Semiconductor

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Pbfree Code No No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 33 X 33 MM, PLASTIC, FCBGA-1023 33 X 33 MM, 1 MM PITCH , LEAD FREE, PLASTIC, FCBGA-1023
Pin Count 1023 1023
Reach Compliance Code not_compliant not_compliant
ECCN Code 5A002.A 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 133 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B1023 S-PBGA-B1023
JESD-609 Code e0 e2
Length 33 mm 33 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 1023 1023
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA1023,32X32,40 BGA1023,32X32,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.38 mm 3.38 mm
Speed 1500 MHz 1500 MHz
Supply Voltage-Max 1.155 V 1.155 V
Supply Voltage-Min 1.045 V 1.045 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) Tin/Silver (Sn/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 33 mm 33 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
Samacsys Manufacturer NXP

Compare MPC8572EPXAVND with alternatives

Compare MPC8572ELVTAVNE with alternatives