MPC860DPVR50D4R2
vs
TSXPC860SRMZPU50D
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ATMEL CORP
|
| Package Description |
,
|
BGA, BGA357,19X19,50
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
357
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
50 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-30 Code |
|
S-PBGA-B357
|
| JESD-609 Code |
|
e0
|
| Length |
|
25 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
357
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA357,19X19,50
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.05 mm
|
| Speed |
|
50 MHz
|
| Supply Voltage-Max |
|
3.465 V
|
| Supply Voltage-Min |
|
3.135 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
25 mm
|
|
|
|
Compare MPC860DPVR50D4R2 with alternatives
Compare TSXPC860SRMZPU50D with alternatives