MPX5050DP
vs
MPX5050GVSX
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Reach Compliance Code |
unknown
|
unknown
|
Accuracy-Max (%) |
2.5%
|
2.5%
|
Additional Feature |
TEMPERATURE COMPENSATED, SIGNAL CONDITIONED
|
TEMPERATURE COMPENSATED, SIGNAL CONDITIONED
|
Body Breadth |
10.67 mm
|
16.25 mm
|
Body Height |
28.7 mm
|
19.05 mm
|
Body Length or Diameter |
29.46 mm
|
27.94 mm
|
Housing |
PLASTIC
|
PLASTIC
|
JESD-609 Code |
e0
|
|
Linearity (%) |
2.5 %
|
2.5 %
|
Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
Offset-Nom |
0.20V
|
0.20V
|
Operating Current-Max |
10 mA
|
10 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Range |
0-40mV
|
0-40mV
|
Output Type |
ANALOG VOLTAGE
|
ANALOG VOLTAGE
|
Port Type |
BARBED
|
BARBED
|
Pressure Range-Max |
7.25 Psi
|
7.25 Psi
|
Pressure Range-Min |
|
|
Pressure Sensing Mode |
DIFFERENTIAL
|
GAGE
|
Response Time |
1000 µs
|
1000 µs
|
Sensors/Transducers Type |
PRESSURE SENSOR,PIEZORESISTIVE
|
PRESSURE SENSOR,PIEZORESISTIVE
|
Supply Voltage-Max |
16 V
|
16 V
|
Supply Voltage-Min |
10 V
|
10 V
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
1
|
1
|
Package Shape/Style |
|
ROUND
|
|
|
|
Compare MPX5050DP with alternatives
Compare MPX5050GVSX with alternatives