MQ80960MC-25 vs AM29000-20/BYC feature comparison

MQ80960MC-25 Rochester Electronics LLC

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AM29000-20/BYC AMD

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ADVANCED MICRO DEVICES INC
Part Package Code QFP QFP
Package Description CERAMIC, QFP-164 QFF, QFL164,1.2SQ,25
Pin Count 164 164
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 50 MHz 20 MHz
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CQFP-F164 S-CQFP-F164
JESD-609 Code e0 e0
Length 28.702 mm 29.2735 mm
Low Power Mode NO YES
Number of Terminals 164 164
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code GQFF QFF
Package Shape SQUARE SQUARE
Package Style FLATPACK, GUARD RING FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.92 mm 2.8702 mm
Speed 25 MHz 20 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position QUAD QUAD
Width 28.702 mm 29.2735 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Additional Feature ON-CHIP BRANCH TARGET CACHE; 4 STAGE PIPELINE
Package Equivalence Code QFL164,1.2SQ,25
Screening Level 38535Q/M;38534H;883B
Supply Current-Max 500 mA

Compare MQ80960MC-25 with alternatives

Compare AM29000-20/BYC with alternatives