MQ80960MC-25
vs
AM29000-20/BYC
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
CERAMIC, QFP-164
|
QFF, QFL164,1.2SQ,25
|
Pin Count |
164
|
164
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
50 MHz
|
20 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-CQFP-F164
|
S-CQFP-F164
|
JESD-609 Code |
e0
|
e0
|
Length |
28.702 mm
|
29.2735 mm
|
Low Power Mode |
NO
|
YES
|
Number of Terminals |
164
|
164
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
GQFF
|
QFF
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, GUARD RING
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.92 mm
|
2.8702 mm
|
Speed |
25 MHz
|
20 MHz
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28.702 mm
|
29.2735 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
ON-CHIP BRANCH TARGET CACHE; 4 STAGE PIPELINE
|
Package Equivalence Code |
|
QFL164,1.2SQ,25
|
Screening Level |
|
38535Q/M;38534H;883B
|
Supply Current-Max |
|
500 mA
|
|
|
|
Compare MQ80960MC-25 with alternatives
Compare AM29000-20/BYC with alternatives