MR1130
vs
MR1130HR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
DIGITRON SEMICONDUCTORS
|
| Package Description |
O-MUPM-D1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1 V
|
1 V
|
| JEDEC-95 Code |
DO-4
|
DO-4
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
300 A
|
300 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
190 °C
|
190 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Output Current-Max |
12 A
|
12 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
1000 V
|
1000 V
|
| Reverse Current-Max |
500 µA
|
500 µA
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Breakdown Voltage-Min |
|
1000 V
|
| JESD-609 Code |
|
e0
|
| Reference Standard |
|
MIL-19500
|
| Reverse Test Voltage |
|
1000 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|