MR27V1641L-XXXMPZ03A
vs
MR27V1641L-XXXMPZ03D
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LAPIS SEMICONDUCTOR CO LTD
|
LAPIS SEMICONDUCTOR CO LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
150 ns
|
150 ns
|
| Clock Frequency-Max (fCLK) |
30 MHz
|
30 MHz
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e6
|
e6
|
| Length |
10.3 mm
|
10.3 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
MASK ROM
|
MASK ROM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
2.65 mm
|
| Supply Current-Max |
0.02 mA
|
0.02 mA
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN BISMUTH
|
TIN BISMUTH
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MR27V1641L-XXXMPZ03A with alternatives
Compare MR27V1641L-XXXMPZ03D with alternatives