MR750
vs
MR750FR
feature comparison
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
SOLID STATE INC
|
MICRO COMMERCIAL COMPONENTS
|
Package Description |
PLASTIC PACKAGE-2
|
O-XALF-W2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
GENERAL PURPOSE
|
EFFICIENCY
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
O-PADB-W2
|
O-XALF-W2
|
Non-rep Pk Forward Current-Max |
400 A
|
300 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
6 A
|
6 A
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
DISK BUTTON
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
Surface Mount |
NO
|
NO
|
Terminal Form |
WIRE
|
WIRE
|
Terminal Position |
AXIAL
|
AXIAL
|
Base Number Matches |
1
|
3
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Reverse Recovery Time-Max |
|
0.15 µs
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MR750 with alternatives
Compare MR750FR with alternatives