MR751
vs
MR751
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSEMI CORP
|
| Package Description |
LEADED BUTTON, 2 PIN
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.9 V
|
0.9 V
|
| JESD-30 Code |
O-XADB-W2
|
O-XADB-W2
|
| JESD-609 Code |
e0
|
e0
|
| Non-rep Pk Forward Current-Max |
400 A
|
400 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Output Current-Max |
6 A
|
6 A
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
DISK BUTTON
|
DISK BUTTON
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Current-Max |
25 µA
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Base Number Matches |
12
|
1
|
| Additional Feature |
|
LOW FORWARD VOLTAGE, LOW LEAKAGE CURRENT
|
| Operating Temperature-Max |
|
175 °C
|
|
|
|
Compare MR751 with alternatives
Compare MR751 with alternatives