MRF454
vs
MRF454
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TE CONNECTIVITY LTD
|
MOTOROLA INC
|
| Pin Count |
4
|
|
| Manufacturer Package Code |
CASE 211-11
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Collector Current-Max (IC) |
20 A
|
20 A
|
| Collector-Emitter Voltage-Max |
25 V
|
25 V
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Current Gain-Min (hFE) |
40
|
40
|
| JESD-30 Code |
O-CRFM-F4
|
O-CRFM-F4
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Position |
RADIAL
|
RADIAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
FLANGE MOUNT, O-CRFM-F4
|
| HTS Code |
|
8541.29.00.95
|
| Collector-Base Capacitance-Max |
|
250 pF
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
150 °C
|
| Power Dissipation Ambient-Max |
|
250 W
|
| Power Dissipation-Max (Abs) |
|
250 W
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare MRF454 with alternatives
Compare MRF454 with alternatives