MRF858S
vs
CBSL6
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
ASI SEMICONDUCTOR INC
|
Package Description |
FLATPACK, R-CDFP-F6
|
FLANGE MOUNT, R-CDFM-F6
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
CASE 319A-02
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.75
|
|
Additional Feature |
WITH EMITTER BALLASTING RESISTORS
|
|
Collector-Base Capacitance-Max |
8 pF
|
8.5 pF
|
Collector-Emitter Voltage-Max |
30 V
|
24 V
|
Configuration |
SINGLE
|
SINGLE
|
DC Current Gain-Min (hFE) |
30
|
20
|
Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
JESD-30 Code |
R-CDFP-F6
|
R-CDFM-F6
|
Number of Elements |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
200 °C
|
200 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLANGE MOUNT
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation Ambient-Max |
20 W
|
|
Power Dissipation-Max (Abs) |
20 W
|
53 W
|
Power Gain-Min (Gp) |
11 dB
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
2
|
Collector Current-Max (IC) |
|
2.4 A
|
|
|
|
Compare MRF858S with alternatives
Compare CBSL6 with alternatives