MRF8P20140WHSR3
vs
MRF8S19140HSR3
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
FLATPACK, R-CDFP-F4
|
FLATPACK, R-CDFP-F2
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
5A991
|
HTS Code |
8541.29.00
|
8541.29.00.75
|
Case Connection |
SOURCE
|
|
Configuration |
SEPARATE, 2 ELEMENTS
|
|
DS Breakdown Voltage-Min |
65 V
|
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
|
Highest Frequency Band |
S BAND
|
|
JESD-30 Code |
R-CDFP-F4
|
|
Number of Elements |
2
|
|
Number of Terminals |
4
|
|
Operating Mode |
ENHANCEMENT MODE
|
|
Operating Temperature-Max |
125 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
FLATPACK
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity/Channel Type |
N-CHANNEL
|
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
|
Terminal Form |
FLAT
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Transistor Application |
AMPLIFIER
|
|
Transistor Element Material |
SILICON
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MRF8P20140WHSR3 with alternatives
Compare MRF8S19140HSR3 with alternatives