MS82000RKX-10 vs EDI8F82048C70BSC feature comparison

MS82000RKX-10 Mosaic Semiconductor Inc

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EDI8F82048C70BSC White Electronic Designs Corp

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC WHITE ELECTRONIC DESIGNS CORP
Package Description , SIP-36
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 100 ns 70 ns
JESD-30 Code R-XSMA-T36 R-XSMA-T36
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 36 36
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX8 2MX8
Output Enable YES
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code SIP36
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.02 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.21 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MS82000RKX-10 with alternatives

Compare EDI8F82048C70BSC with alternatives