MSC8144TVT800A
vs
MSC8144ETVT800B
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
BGA,
|
Pin Count |
783
|
783
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Barrel Shifter |
NO
|
NO
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
133 MHz
|
133 MHz
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
JESD-609 Code |
e2
|
e2
|
Length |
29 mm
|
29 mm
|
Low Power Mode |
NO
|
NO
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
783
|
783
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.176 mm
|
3.176 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.97 V
|
0.97 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER
|
Tin/Silver (Sn/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
29 mm
|
29 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare MSC8144TVT800A with alternatives
Compare MSC8144ETVT800B with alternatives