MSC8144VT800A
vs
MSC8144EVT1000B
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA783,28X28,40
|
BGA,
|
| Pin Count |
783
|
783
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Barrel Shifter |
NO
|
NO
|
| Bit Size |
16
|
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
133 MHz
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B783
|
S-PBGA-B783
|
| JESD-609 Code |
e2
|
e2
|
| Length |
29 mm
|
29 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
783
|
783
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA783,28X28,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
16384
|
|
| Seated Height-Max |
3.176 mm
|
3.176 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.97 V
|
0.97 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
TIN SILVER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
29 mm
|
29 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare MSC8144VT800A with alternatives
Compare MSC8144EVT1000B with alternatives