MSM531001BGS-K vs UM23C1101M-100 feature comparison

MSM531001BGS-K OKI Electric Industry Co Ltd

Buy Now Datasheet

UM23C1101M-100 United Microelectronics Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer OKI ELECTRIC INDUSTRY CO LTD UNITED MICROELECTRONICS CORP
Part Package Code SOIC
Package Description SOP, ,
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 100 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
Length 21 mm
Memory Density 134217728 bit 1048576 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 8MX16 128KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 11 mm
Base Number Matches 2 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Supply Current-Max 0.03 mA
Temperature Grade COMMERCIAL

Compare MSM531001BGS-K with alternatives

Compare UM23C1101M-100 with alternatives