MSP1N3017DUR-1E3TR vs 1N4737-TP feature comparison

MSP1N3017DUR-1E3TR Microsemi Corporation

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1N4737-TP Micro Commercial Components

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICRO COMMERCIAL COMPONENTS CORP
Part Package Code DO-213AB DO-41
Package Description O-LELF-R2 ROHS COMPLIANT, HEREMATIC SEALED, GLASS, DO-41G, 2 PIN
Pin Count 2 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED, HIGH RELIABILITY
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JEDEC-95 Code DO-213AB DO-41
JESD-30 Code O-LELF-R2 O-LALF-W2
JESD-609 Code e3 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 150 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.25 W 1 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 7.5 V 7.5 V
Surface Mount YES NO
Technology ZENER ZENER
Terminal Finish MATTE TIN MATTE TIN
Terminal Form WRAP AROUND WIRE
Terminal Position END AXIAL
Voltage Tol-Max 1% 10%
Working Test Current 34 mA 34 mA
Base Number Matches 1 1
Pbfree Code Yes
Dynamic Impedance-Max 4 Ω
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 10

Compare MSP1N3017DUR-1E3TR with alternatives

Compare 1N4737-TP with alternatives