MSP1N4743AP
vs
1N4743ARL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DO-41
|
|
| Package Description |
O-PALF-W2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-204AL
|
|
| JESD-30 Code |
O-PALF-W2
|
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
150 °C
|
200 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
1 W
|
1 W
|
| Reference Standard |
MIL-19500
|
|
| Reference Voltage-Nom |
13 V
|
13 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
19 mA
|
19 mA
|
| Base Number Matches |
1
|
6
|
| Dynamic Impedance-Max |
|
10 Ω
|
|
|
|
Compare MSP1N4743AP with alternatives